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ASE Invests NT$123.7 Billion in AI-Driven Semiconductor Packaging Expansion
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On 6 November, Taiwan reported that ASE Semiconductor planned NT$123.7 billion (approximately US$3.74 billion) to expand automated chip packaging and testing facilities in Kaohsiung and Tainan. The company plans to use AI, big-data analysis and automated...
On 6 November, Taiwan reported that ASE Semiconductor planned NT$123.7 billion (approximately US$3.74 billion) to expand automated chip packaging and testing facilities in Kaohsiung and Tainan. The company plans to use AI, big-data analysis and automated equipment to improve production efficiency and yields.
The expansion creates opportunities in AI applications, semiconductor technology and industrial automation. HPC can support digital transformation, technology assessments, AI strategy and industrial partnerships.